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More smartphone components to be included under Make in India to boost manufacturing

IBEF:  May 08, 2017

New Delhi: The Government of India has launched a phased manufacturing programme (PMP) aimed at adding more smartphone components under the Make in India initiative thereby giving a push to the domestic manufacturing of mobile handsets. The programme will help to create an indigenous mobile manufacturing ecosystem in India and also to meet a major share of the global handset demand over the coming years, stated Ms Aruna Sundararajan, Secretary, Ministry of Electronics and Information Technology, Government of India. The programme includes mechanics, die cut parts, microphone, receiver, keypad and USB cable for FY 2017-18; populated printed circuit boards, camera modules and connectors for FY 2018-19; and display assembly, touch panels, vibrator motor and ringer for FY 2019-20.

Disclaimer: This information has been collected through secondary research and IBEF is not responsible for any errors in the same.