An MoU on semiconductor supply chain and innovation partnership has been signed between India and the US
- Press Information Bureau
- March 13, 2023
India and the US signed a memorandum of understanding (MoU) on establishing a semiconductor supply chain and innovation partnership under the India–US Commercial Dialogue in New Delhi on March 10, 2023.
US Secretary of Commerce, Ms. Gina Raimondo is on a visit to New Delhi, at the request of Mr. Piyush Goyal, Union Minister of Commerce and Industry. The India-US Commercial Dialogue was re-launched as part of this visit to discuss collaboration for unlocking new trade and investment possibilities between the two nations.
The aim of the MoU is to establish a collaborative mechanism between the Governments of India and the US on semiconductor supply chain resiliency and diversification in view of US’ CHIPS and Science Act and India’s Semiconductor Mission.
Through discussions on different aspects of the semiconductor value chain, the MoU seeks to take advantage of the complementary strengths of both nations and facilitate commercial opportunities and the development of semiconductor innovation ecosystems.
Disclaimer: This information has been collected through secondary research and IBEF is not responsible for any errors in the same.
Partners
