Prime Minister Mr. Narendra Modi inaugurated the Micron Technology Semiconductor Assembly, Test, Marking, and Packaging (ATMP) facility in Sanand, Gujarat, marking the commencement of commercial production at this landmark unit that will position India more strongly in the global semiconductor value chain. The event signifies a major milestone in India's transformation from a software-led to a hardware-inclusive technology leader. The project progressed rapidly from the Memorandum of Understanding in June 2023 to groundbreaking in September 2023, machine installations by February 2024, and now full commercial production. The statement further emphasised India’s streamlined regulatory environment, noting that processes such as Advanced Pricing Agreements (APAs) that can take 3–5 years in other countries were completed in a matter of months in India. The facility, supported by robust India-USA collaboration and the Pax Silica agreement to strengthen critical mineral supply chains, will primarily manufacture D-RAM and NAND products for global data centres, mobile, and AI applications.
Highlighting the sector’s broader impact, the statement noted that semiconductor production catalyzes a multi-layered ecosystem encompassing machine manufacture, design, logistics, and skilled manpower, and is closely aligned with the India Semiconductor Mission 2.0 announced in the Union Budget. The production ramp-up is expected to trigger increased demand for materials, services, and electronics components, benefitting manufacturers and start-ups nationwide. With 10 approved Semicon India projects and more coming online in states including Uttar Pradesh, Assam, Punjab, and Odisha, this initiative supports India’s ‘Make in India’ vision while catering to rising domestic demand from a growing base of first-time gadget users.
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